P_1x2R_007_A

Parts committed by Bolla Gino on date 2/18/2008

PartID
BBMBBM_007-1x2T
VHDI1x2R_616

ROCROC waferLabel
ROC0W53_DXLQY9T04C
ROC1W53_DXLQY9T04B

Inspected by Lockwood Gale on date 2/22/2008
LR_dev0.057
LL_dev0.046

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Lockwood GaleForce used to join BBM to VHDI = 2 kg per ROC. No assembly problems. No wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 2/22/2008 by Lockwood Gale

PLAQUETTE encapsulated on 2/23/2008 by Ozhan Koybasi

PLAQUETTE made READY for testing on 2/23/2008 by Ozhan Koybasi

P_1x2R_007_Aon 2/26/2008 12:29 AM

P_1x2R_007_A-1on 2/26/2008 1:13 PM

P_1x2R_007_A-1on 2/26/2008 1:13 PM

PLAQUETTE TESTED on 2008-02-26 by Ozhan Koybasi

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
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LASER_XML-File
Depletion Voltage 58 V
Operational Voltage 98 V

ROCROC0ROC1
Ibias_DAC162154
Vana148158
Cal_Del7686
Vthrs_Comp8993
Unbumped00
Dead20
Noisy00
Undecoded00
Total BAD20

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe105100
Vsf145155
VoffsetOp100110
VIbias_PH100105

Noise MAP at VMAX

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Efficiency MAP

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Noise MAP at -200 V

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Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2008-02-27