P_1x2R_003_A

Parts committed by Bolla Gino on date 2/18/2008

PartID
BBMBBM_003-1x2T
VHDI1x2R_615

ROCROC waferLabel
ROC0W53_DXLQY9T21D
ROC1W53_DXLQY9T21B

Inspected by Arndt Kirk on date 2/19/2008
LR_dev0.017
LL_dev0.038

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Arndt KirkForce used to join BBM to VHDI = 2 kg per ROC. No assembly problems. No wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 2/19/2008 by Arndt Kirk

PLAQUETTE encapsulated on 2/20/2008 by Ozhan Koybasi

PLAQUETTE made READY for testing on 2/20/2008 by Ozhan Koybasi

P_1x2R_003_Aon 2/20/2008 1:50 PM

P_1x2R_003_Aon 2/20/2008 1:50 PM

PLAQUETTE TESTED on 2008-02-20 by Ozhan Koybasi

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
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LASER_XML-File
Depletion Voltage 46 V
Operational Voltage 86 V

ROCROC0ROC1
Ibias_DAC156158
Vana145134
Cal_Del6780
Vthrs_Comp8888
Unbumped00
Dead00
Noisy00
Undecoded00
Total BAD00

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe95110
Vsf145140
VoffsetOp110105
VIbias_PH100100

Noise MAP at VMAX

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Efficiency MAP

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Noise MAP at -200 V

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Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2008-02-27