P_1x2L_163_C

Parts committed by Arndt Kirk on date 5/1/2007

PartID
BBMBBM_163-1x2T
VHDI1x2L_263

ROCROC waferLabel
ROC0KNN0GDT32B
ROC1KNN0GDT32A

Inspected by Lockwood Gale on date 5/4/2007
LR_dev0.063
LL_dev0.074

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Lockwood GaleAssembled at HALF-PRESSURE. No assembly problems. No wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 5/4/2007 by Lockwood Gale

PLAQUETTE encapsulated on 5/4/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 5/4/2007 by Ozhan Koybasi

P_1x2L_163_Con 5/7/2007 3:37 PM

P_1x2L_163_Con 5/7/2007 3:37 PM

PLAQUETTE TESTED on 2007-05-07 by mia tosi

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 50 V
Operational Voltage 90 V

ROCROC0ROC1
Ibias_DAC142138
Vana131141
Cal_Del7273
Vthrs_Comp8389
Unbumped00
Dead00
Noisy00
Undecoded00
Total BAD00

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe130100
Vsf140140
VoffsetOp10590
VIbias_PH105100

Noise MAP

[IMAGE] of

Efficiency MAP

[IMAGE] of

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-05-11