1. The 1st character is either a "W" or a "B", with "W" designating sensor on-wafer and "B" designating a bump-bonded module.
2. The 2nd character is a "L" or a "S" or an "A" or a "D" depending on the sensor type, either a 2x8, 1x1, slim-edge, or a diode.
3. The 3rd character is always an "_" (underscore).
4. The next 2 characters are associated with the position of diodes or sensors on the wafers and can be the following:
a. 2x8(L)
i. TT(Top)
ii. FL(Far Left),LL(Left),CL(Center Left),CR(Center Right),RR(Right), and FR(Far Right)
iii. BB(Bottom)
b. 1x1(S)
i. TL(Top Left),TR(Top Right)
ii. CL(Center Left),CR(Center Right)
iii. BL(Bottom Left),BR(Bottom Right)
c. Slim-Edge(A)
i. TL(Top Left), TR(Top Right)
ii. BL(Bottom Left), BR(Bottom Right)
d. Diode(D)
i. TL(Top Left), TR(Top Right)
ii. BL(Bottom Left, BR(Bottom Right)
5. The next character is an "_"(underscore).
6. The next three characters are 3 digits associated with the Sensor Wafer number:
a. Preproduction sensors use 9 in the first of the 3 digits, ex. 901
b. Production sensors are limited to numbers between 001 and 200
Examples:
BL_TT_035: A 2x8 bump-bonded module, using the top 2x8 sensor from production wafer #035.
WS_BR_045: A bottom right 1x1 sensor in production wafer #045.
BA_TR_901: A 1x1 bump-bonded module, using top-right slim-edge sensor from preproduction wafer #901.
The following is based on a document detailing a new module naming scheme based on HDI labels and is an update from the original naming scheme. The full document can be downloaded here.
The naming convention for a fully assembled 2x8 module (including HDI) is "W-X-Y-ZZ"(a total of 8 characters) where:
1. The 1st character is an "M" for production modules and a "P" for pre-production modules.
2. The 2nd character is always a "-"(hyphen).
3. The next character is associated with the work order and timestamp of the HDI attached to the module:
| HDI Rev D batch | HDI Serial Number | HDI Production Modules | HDI Preproduction Modules |
| Preproduction | YHC69-1015 | No production modules | P-A-x-yy |
| Batch 1 | YHD19-1815 | M-B-x-yy | P-B-x-yy |
| Batch 2 | YHD27-1015 | M-C-x-yy | P-C-x-yy |
| Batch 3 | YHD22-2015 | No production modules | P-D-x-yy |
| Batch 4 | YFC67-2915 | No production modules | No preproduction modules |
| Batch 5 | YFC73-3415 | M-F-x-yy | No preproduction modules |
| Batch 6 | YFC89-3815 | M-G-x-yy | No preproduction modules |
| Batch 7 | YFC84-3915 | M-H-x-yy | No preproduction modules |
| Batch 8 | YFD00-4715 | M-I-x-yy | No preproduction modules |
| Batch 9 | YFD04-4715 | M-J-x-yy | No preproduction modules |
4. The next character is a "-"(hyphen).
5. The next character is the panel number (between 1 and 8) of the HDI attached to the module.
6. The next character is a "-"(hyphen).
7. The next 2 characters are the panel position (between 01 and 50) of the HDI attached to the module.
Example:
P-A-2-27: A fully-assembled pre-production module with HDI YHC69-1015-2-27.
M-F-5-22: A fully-assembled production module with HDI from batch 5.