FBK_A12_2_2

Added to Database: 2013-06-03 15:51:31

From Wafer:
FBK_A12_2

On Module:
None

IV/CV Scans:
No scan data for this part



No scan data for this part



No pictures for this part

Notes:
2013-06-03 15:51:32 This sensor had a significant amount of residue on the UBM side that possibly impeded bump-bonding it to a ROC on 5-16.