FBK_A11_36_2_W54_45D

Added to Database: 2013-06-03 16:55:33

Comprised of:
Sensor: FBK_A11_36_2 and ROC: W54_45D

IV/CV Scans:
No scan data for this part



No scan data for this part



DAQ Data:

	2013-06-05 11:48:35 Zoomed-in view of UBM pads post-ROC removal showing transfer of metal.
	2013-06-05 11:49:51 UBM on unbonded sensor.

Notes:
2013-06-03 16:55:33 Originally bonded on 5-30-2013. Part did not move in reflow.
2013-06-04 10:10:17 Module was disassembled on 5-31-2013. UBM pads post-removal show metal, indicating there was good enough alignment during bump-bonding.