| Wafers | Recieved | Inspected | Total |
| 22 | 1 | 23 |
| Sensors | In Database | Tested(On-Wafer) | Diced | Tested(Pre-Assembly) | Ready for Assembly | On Module | Total |
| 180 | 1 | 0 | 1 | 0 | 0 | 182 |
| Modules | Bump Bonded | Wirebonded | Inspected | Tested(Post-Wirebonding) | Encapsulated | Tested(Post-Encapsulation) | Ready for Shipping | Shipped | Total |
| 39 | 0 | 3 | 0 | 0 | 0 | 1 | 0 | 43 |