P_2x4B_131

P_2x4B_131_A

Parts committed by Bolla Gino on date 11/13/2006

Part	ID
BBM	BBM_131-2x4B
VHDI	2x4_305

ROC ROC wafer Label

ROC0 W19_XN4K38T 11A

ROC1 W19_XN4K38T 29C

ROC2 W19_XN4K38T 04A

ROC3 W19_XN4K38T 28A

ROC4 W19_XN4K38T 13C

ROC5 W19_XN4K38T 03B

ROC6 W19_XN4K38T 14B

ROC7 W19_XN4K38T 14C

ROC	ROC wafer	Label
ROC0	W19_XN4K38T	11A
ROC1	W19_XN4K38T	29C
ROC2	W19_XN4K38T	04A
ROC3	W19_XN4K38T	28A
ROC4	W19_XN4K38T	13C
ROC5	W19_XN4K38T	03B
ROC6	W19_XN4K38T	14B
ROC7	W19_XN4K38T	14C

Inspected by Arndt Kirk on date 11/14/2006

LR_dev 0.030

LL_dev 0.055

FINAL COMMENT by Arndt Kirk No assembly problems. Some silicon debri between bond pads on VHDI, not removed by airdusting or pick.

PLAQUETTE made READY for testing on 11/14/2006 by Arndt Kirk

PLAQUETTE TESTED on 2006-11-14 by Isaac Childres

IV_XML-File

Maximum Voltage 600 V

LASER_XML-File

Depletion Voltage 44 V

Operational Voltage 84 V

ROC	ROC0	ROC1	ROC2	ROC3	ROC4	ROC5	ROC6	ROC7
Ibias_DAC	132	153	155	131	131	127	140	141
Vana	127	133	132	117	122	134	135	111
Cal_Del	74	61	72	87	81	87	77	84
Vthrs_Comp	86	77	89	72	78	75	71	67
Unbumped	0	0	0	0	0	0	0	1
Dead	0	0	0	0	0	0	0	0
Noisy	0	0	0	0	0	0	0	0
Undecoded	0	0	0	0	0	0	0	0
Total BAD	0	0	0	0	0	0	0	1

ASSEMBLY_XML-File	SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
	I_BIAS_DAC_XML-File
	VANA_XML-File
	DEAD_XML-File
	NOISY_XML-File
	UNDECODED_XML-File
	LIGHT_XML-File

PLAQUETTE READY FOR SHIPPING

Shipped on date 2006-11-15

Plaquette assigned to panel P3L_009