Parts committed by Arndt Kirk on date 3/1/2007
Part | ID |
---|---|
BBM | BBM_116-2x4B |
VHDI | 2x4_610 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W34_XA4K3PT | 11D |
ROC1 | W34_XA4K3PT | 11C |
ROC2 | W34_XA4K3PT | 29C |
ROC3 | W34_XA4K3PT | 29B |
ROC4 | W34_XA4K3PT | 06A |
ROC5 | W34_XA4K3PT | 06C |
ROC6 | W34_XA4K3PT | 06D |
ROC7 | W33_XC4K5LT | 13C |
Inspected by Arndt Kirk on date 3/5/2007
LR_dev | 0.058 |
LL_dev | 0.058 |
FINAL COMMENT by Arndt Kirk | No assembly problems. All wirebonds OK. ROC4 chn 8,20 and ROC5 chn 34 required multiple attempts to bond VHDI pads. |
PLAQUETTE made READY for ENCAPSULATION on 3/5/2007 by Arndt Kirk
PLAQUETTE encapsulated on 3/6/2007 by Ozhan Koybasi
PLAQUETTE made READY for testing on 3/6/2007 by Ozhan Koybasi
P_2x4B_116_Aon 3/7/2007 1:29 PM
P_2x4B_116_Aon 3/7/2007 1:29 PM
PLAQUETTE TESTED on 2007-03-07 by Isaac Childres
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | ROC6 | ROC7 | |
Ibias_DAC | 118 | 138 | 148 | 140 | 144 | 118 | 142 | 134 | |
Vana | 118 | 120 | 139 | 110 | 115 | 105 | 129 | 124 | |
Cal_Del | 92 | 90 | 74 | 85 | 89 | 79 | 78 | 87 | |
Vthrs_Comp | 62 | 67 | 88 | 73 | 70 | 74 | 74 | 63 | |
Unbumped | 0 | 0 | 0 | 1 | 0 | 0 | 0 | 0 | |
Dead | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 0 | 0 | 0 | 1 | 0 | 0 | 0 | 0 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 120 | 135 | 110 | 185 | 160 | 170 | 130 | 115 |
Vsf | 130 | 135 | 140 | 135 | 135 | 130 | 140 | 130 |
VoffsetOp | 60 | 80 | 110 | 95 | 80 | 100 | 85 | 75 |
VIbias_PH | 100 | 100 | 105 | 100 | 100 | 95 | 100 | 95 |
Noise MAP
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED