Parts committed by Bolla Gino on date 2/18/2008
Part | ID |
---|---|
BBM | BBM_003-2x4B |
VHDI | 2x4_211 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W53_DXLQY9T | 11D |
ROC1 | W53_DXLQY9T | 29A |
ROC2 | W53_DXLQY9T | 28C |
ROC3 | W53_DXLQY9T | 28B |
ROC4 | W53_DXLQY9T | 14A |
ROC5 | W53_DXLQY9T | 14B |
ROC6 | W53_DXLQY9T | 14C |
ROC7 | W53_DXLQY9T | 14D |
Inspected by Lockwood Gale on date 2/19/2008
LR_dev | 0.050 |
LL_dev | 0.050 |
PLAQUETTE GLUED with HALF PRESSURE
FINAL COMMENT by Lockwood Gale | Force used to join BBM to VHDI = 2.5 kg per ROC. No assembly problems. No wirebonding problems. |
PLAQUETTE made READY for ENCAPSULATION on 2/19/2008 by Lockwood Gale
PLAQUETTE encapsulated on 2/20/2008 by Ozhan Koybasi
PLAQUETTE made READY for testing on 2/20/2008 by Ozhan Koybasi
P_2x4B_003_Aon 2/20/2008 1:17 PM
P_2x4B_003_Aon 2/20/2008 1:17 PM
PLAQUETTE TESTED on 2008-02-20 by Ozhan Koybasi
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | ROC6 | ROC7 | |
Ibias_DAC | 156 | 162 | 164 | 160 | 174 | 162 | 146 | 158 | |
Vana | 141 | 137 | 161 | 157 | 144 | 153 | 144 | 153 | |
Cal_Del | 88 | 68 | 76 | 83 | 87 | 78 | 94 | 87 | |
Vthrs_Comp | 84 | 93 | 88 | 92 | 91 | 89 | 89 | 85 | |
Unbumped | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Dead | 1 | 1 | 0 | 1 | 0 | 0 | 0 | 6 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 1 | 1 | 0 | 1 | 0 | 0 | 0 | 6 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 105 | 100 | 90 | 90 | 100 | 100 | 95 | 95 |
Vsf | 140 | 140 | 155 | 150 | 145 | 150 | 140 | 145 |
VoffsetOp | 105 | 115 | 105 | 115 | 130 | 125 | 95 | 115 |
VIbias_PH | 95 | 95 | 100 | 100 | 95 | 100 | 105 | 95 |
Noise MAP at VMAX
Efficiency MAP
Noise MAP at -200 V
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED