Sensor: S_2x3T_04, Data for leakage current measurement , and plot on overall it is a GOOD sensor
| ROC | ROC wafer | Label |
|---|---|---|
| ROC0 | XF4K3JT | 21D |
| ROC1 | XF4K3JT | 24D |
| ROC2 | XF4K3JT | 22C |
| ROC3 | XF4K3JT | 32B |
| ROC4 | XF4K3JT | 32A |
| ROC5 | XF4K3JT | 31B |
| Ibias_DAC, Ibias_DAC Data | 127 | 124 | 126 | 126 | 157 | 135 |
| Vana, VanaData | 117 | 135 | 127 | 121 | 131 | 125 |
| CalDelData and plots | 92 | 85 | 82 | 90 | 71 | 85 |
| VthrCompData and plots | 79 | 68 | 83 | 64 | 75 | 72 | Depletion Voltage is -42 and suggested operational voltage is -82
| TestDdata ,TestD Plots | 0 | 0 | 28 | 0 | 0 | 0 |
| LightData ,Light Plots | 712 | 120 | 53 | 5 | 7 | 69 |
| Pass/Fail TestD | GOOD | GOOD | GOOD | GOOD | GOOD | GOOD |
| Pass/Fail LIGHT | BAD | BAD | BAD | GOOD | GOOD | BAD |
Comment (if any): The area of bad bumps in ROC0 got larger after the wire bond hammering excercise. In the other ROCs, some bad bumps went away, and some new ones were introduced. ROC2 also has lower address levels and therefore a few decoding problems.
This Device have been tested 0Times prior to this one and here are the links to the previous tests:End testing time: 12:02 PM
