P_2x3T_026_C

Parts committed by Bolla Gino on date CCYY-MM-DD

PartID
BBMBBM_026-2x3T
VHDI2x3_315

ROCROC waferLabel
ROC0XL4K3DT27A
ROC1XL4K3DT27B
ROC2XL4K3DT28B
ROC3XL4K3DT22A
ROC4XL4K3DT21A
ROC5XL4K3DT20B

Inspected by Arndt Kirk on date 2006-07-27
LR_dev0.036
LL_dev0.041
FINAL COMMENT by Arndt KirkNo problem assembly. No wirebonding problem

PLAQUETTE made READY for testing on 2006-07-31 by Arndt Kirk

PLAQUETTE TESTED on 2006-09-11 by Gino Bolla

[IMAGE] of
IV_XML-File
Maximum Voltage 470 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 44 V
Operational Voltage 84 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC144144149168138141
Vana129108132149122115
Cal_Del678295748389
Vthrs_Comp737072867770
Unbumped129038579300
Dead026200
Noisy000000
Undecoded000000
Total BAD129238639500

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

PLAQUETTE READY FOR SHIPPING

ROC 1,2 and 3 have many BAD bumpd plaquettes is sent back to RTI for rework