P_2x3B_041_C

Parts committed by Bolla Gino on date 11/28/2006

PartID
BBMBBM_041-2x3B
VHDI2x3_201

ROCROC waferLabel
ROC0XF4K3JT22D
ROC1XF4K3JT23C
ROC2XF4K3JT36A
ROC3XF4K3JT35B
ROC4XF4K3JT34B
ROC5XF4K3JT33B

Inspected by Arndt Kirk on date 12/4/2006
LR_dev0.010
LL_dev0.032
FINAL COMMENT by Arndt KirkNo assembly problems. BBM joined to VHDI at nominal pressure. No visible deflection of BBM while wirebonding. No wirebonding problems, all wirebonds look good.

PLAQUETTE made READY for testing on 12/4/2006 by Arndt Kirk

P_2x3B_041_Con 12/5/2006 9:26 AM P_2x3B_041_C-1on 12/6/2006 12:11 PM

PLAQUETTE TESTED on 2006-12-06 by Petra Merkel

[IMAGE] of
IV_XML-File
Maximum Voltage 400 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 44 V
Operational Voltage 84 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC140135129128133137
Vana130121114127127134
Cal_Del879999927787
Vthrs_Comp686862687274
Unbumped0131203
Dead000010
Noisy000000
Undecoded000000
Total BAD0131213

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

PLAQUETTE READY FOR SHIPPING

Shipped on date 2006-12-13