P_1x2L_160_C

Parts committed by Isaac Childres on date 5/15/2007

PartID
BBMBBM_160-1x2T
VHDI1x2L_274

ROCROC waferLabel
ROC0KBNG0QT22C
ROC1KBNG0QT12A

Inspected by Arndt Kirk on date 6/13/2007
PictureComment
[IMAGE] of Crack through VHDI silicon under ROC1 (noticed after BBM joined to VHDI and before wirebonding).

Inspected by Lockwood Gale on date 6/14/2007
LR_dev0.025
LL_dev0.023

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Lockwood GaleAssembled at HALF-PRESSURE. No assembly problems. No wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 6/14/2007 by Lockwood Gale

PLAQUETTE encapsulated on 6/14/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 6/14/2007 by Ozhan Koybasi

P_1x2L_160_Con 6/15/2007 11:46 AM

P_1x2L_160_Con 6/15/2007 11:46 AM

PLAQUETTE TESTED on 2007-06-15 by Emily Grace

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 46 V
Operational Voltage 86 V

ROCROC0ROC1
Ibias_DAC156144
Vana132133
Cal_Del8365
Vthrs_Comp8982
Unbumped00
Dead00
Noisy00
Undecoded00
Total BAD00

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe115105
Vsf140145
VoffsetOp9080
VIbias_PH10095

Noise MAP at VMAX

[IMAGE] of

Efficiency MAP

[IMAGE] of

Noise MAP at -200 V

[IMAGE] of

Efficiency MAP

[IMAGE] of

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-06-28