BBM_085-2x4T

RECEIVED by Bolla Gino on date 10/29/2006 From IZM

ROC	ROC wafer	Label
ROC0	W18_XJ4K3FT	22C
ROC1	W18_XJ4K3FT	22B
ROC2	W18_XJ4K3FT	22A
ROC3	W18_XJ4K3FT	21D
ROC4	W20_XP4K3AT	06D
ROC5	W20_XP4K3AT	06C
ROC6	W20_XP4K3AT	06B
ROC7	W20_XP4K3AT	06A

Inspected by Bolla Gino on date 10/30/2006

Picture	Comment
	defects on diced edge of the sensor. This is an example but it seems to be all over like this. let's see the outcome of the IV.
	Same as before zoomed out to see the extend of it
	and AGAIN it is really all over.

IV Measured by Bolla Gino on date 10/30/2006

IV XML File

DEVICE ready for Plaquette assembly

ACCEPTED by Bolla Gino on date 10/30/2006

committed to PLAQUETTE P_2x4T_085_A by Bolla Gino on date 10/30/2006