Table of Contents
Summary of Bump Bonding Techniques for Pixel Systems
INDEX
Pixels systems
Pixel systems
Bump bonding flip chip technology
Rerouting
Under Bump Metallisation (UBM)
Bumping technologies
Evaporation through mask (C4)
Evaporation with thick photoresist
Screen printing
Stud bumping (SBB)
Electroplating bump bonding
Electroplating bump bonding
Electroless plating
Conductive Polymer Bumps
Flip chip alignment
Reflow
Adhesive bonding
Underfilling
Bump technology comparison
1999 SIA Technology Roadmap
1999 Japan JISSO Technology Roadmap
Testing issues
Rerouting metal contact measurement
Contact resistance results
Other testing issues
Thermal issues
Thermal measurements
Example of thermal measurements
Conclusions
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