(a) High-magnification optical microscope with video camera; (b) Plasma etching and cleaning system; (c) High-vacuum Rapid Thermal Processing (RTP) System; (d) Vacuum Oven; (e) Wire bonder.
(b) Plasma etching and cleaning system; (c) High-vacuum Rapid Thermal Processing (RTP) System; (d) Vacuum Oven; (e) Wire bonder.
(c) High-vacuum Rapid Thermal Processing (RTP) System; (d) Vacuum Oven; (e) Wire bonder.
(d) Vacuum Oven; (e) Wire bonder.
(e) Wire bonder.
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